Spring Test Probe 3mm

Product Overview

3mm spring test probes (pogo pins) are spring-loaded contact pins with 3mm barrel diameter, built for heavy-current and high-load testing. Featuring plunger, barrel and internal compression spring, they deliver stable and consistent contact force under compression, creating reliable temporary electrical connection. Nickel-gold plating brings low contact resistance and anti-oxidation performance. Widely used in power module testing, battery inspection, large PCB, automotive electronics and industrial test jigs.

Key Features

  • 3mm barrel diameter, heavy-duty design: Supports higher rated current compared with fine-pitch small probes
  • Built-in compression spring: Compensates height tolerance of test points, maintains stable contact force
  • Nickel underlayer + gold plating: Low contact resistance, anti-corrosion and anti-oxidation
  • Multiple tip styles available: Conical, crown, dome, chisel tip for different test pads
  • Robust structure: Long service life for repeated compression cycles
  • Customizable: Stroke, spring force, tip profile and total length on request

Technical Parameters

表格

ItemSpecification
Product Name3mm Spring Test Probe / 3mm Pogo Pin
MaterialPlunger: Beryllium copper / Hardened steel; Barrel: Brass; Spring: Music wire
Surface TreatmentNickel + Gold plating
Barrel Diameterφ3.0mm
Stroke1.0mm – 8.0mm (custom)
Spring Force100gf – 500gf
Contact Resistance20 ~ 80 mΩ
Rated Current5A ~ 15A continuous
Operating Temperature-40℃ ~ +125℃
Cycle Life50,000 ~ 800,000 times
Tip OptionsConical, crown, dome, chisel

Application

  • Power module & inverter testing
  • Automotive electronic PCB and component inspection
  • Lithium battery pack, BMS performance test
  • Heavy-load ATE test fixtures and jigs
  • Large-size circuit board functional test (FCT)

3mm Spring Test Probe vs Small-diameter Pogo Pin

表格

Item3mm Spring Test ProbeSmall-diameter Pogo Pin (φ0.2~1.5mm)
Barrel Diameter3.0mm0.2~1.5mm
Current CapacityHigh (up to 15A)Low to medium
Spring ForceHigherLight to medium
Typical UsePower, battery, automotive electronicsFine-pitch IC, BGA, small PCB
Pad RequirementLarger contact padMicro pad for mini components

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