Overview
Bakelite nozzle, also known as electric wood nozzle, is a high-precision vacuum picking consumable specially designed for semiconductor die attach processes. It is widely applied in automatic die bonders to pick and place LED chips, IC bare dies, optoelectronic chips and other fragile micro-components. The nozzle adopts a composite structure with a stainless steel shaft and an anti-static bakelite (modified phenolic resin) suction tip, balancing precision, durability and product protection perfectly.
Material Features
The suction head is made of high-performance modified thermosetting bakelite material, with optional advanced engineering plastic materials such as VESPEL and TOR for high-end scenarios. The reinforced stainless steel shaft ensures excellent clamping rigidity and coaxiality during high-speed operation. All materials are specially modified to achieve anti-static, high-temperature resistant and wear-resistant properties, meeting strict semiconductor packaging standards.
Core Advantages
- Chip Protection & Zero Damage: Moderate hardness effectively avoids indentation, edge chipping and surface damage to thin and brittle chips, which is the biggest advantage over hard alloy tungsten steel nozzles. It greatly improves the yield rate of optical and electronic chips.
- High Temperature Resistance: It can stably withstand operating temperatures above 200°C, and customized high-specification versions support up to 480°C, adapting to high-temperature soldering and die bonding environments.
- Anti-static Performance: Effectively eliminates static electricity accumulation, prevents electrostatic breakdown and failure of precision chips, and protects electronic components safely.
- Precision & Stability: Features good vacuum tightness and no deformation. It supports ultra-small suction hole sizes and customized round, square and special-shaped end faces, suitable for micro and ultra-small size chip picking.
- Cost-Effective: Compared with tungsten steel nozzles, it has lower cost while retaining excellent performance; compared with rubber nozzles, it has longer service life and no structural deformation.
Specification & Customization
Conventional aperture specifications cover 3mil, 3.5mil, 4mil, 5mil, 6mil, 8mil, 10mil up to 40mil. Customized sizes and special-shaped suction surfaces are available to match different chip dimensions and equipment models.
Application Scope
Widely compatible with mainstream automatic die bonders such as ASM, HOSON, YOUGUANG and other packaging equipment. Mainly used for packaging of LED beads, Mini/Micro LED, bare IC chips, photoelectric sensors and other semiconductor components.
Usage Notes
As a precision vulnerable part, the bakelite nozzle may cause material throwing, offset and failure to pick up chips if the end face is damaged or the vacuum hole is blocked. Regular inspection, grinding and replacement are recommended to ensure stable production efficiency.
