1. Product Overview
Ceramic ring air nozzles are precision nitrogen shielding components for automatic wire bonders in semiconductor packaging. Featuring an annular multi-slot airflow structure, they form a uniform nitrogen shroud around the EFO (Electronic Flame Off) ball-forming zone. The nitrogen barrier isolates the molten free-air ball from ambient oxygen to prevent oxidation, dark ball defects and inconsistent ball shear strength.
Fabricated from high-purity alumina ceramic with micron-level grooving, this consumable delivers stable laminar airflow without turbulence that could disturb wire loops. It supports mainstream wire bonder platforms including KS, ASM and other bonding systems, widely deployed in COB, LED, MEMS sensor and discrete IC packaging.
2. Core Features & Advantages
- Annular Laminar Airflow Structure Multiple precision gas distribution grooves create a full-circle nitrogen curtain. Airflow is evenly distributed with no dead zones, suppressing ball oxidation and reducing bonding rejects.
- High-Purity Alumina Ceramic Substrate 99.9% alumina ceramic offers excellent high-temperature resistance, low thermal expansion, insulation and spark resistance. It withstands repeated EFO thermal cycling without cracking or deformation.
- Ultra-Precision Groove Machining Ultra-precision CNC grinding controls groove width and depth within tight tolerances. Balanced gas output avoids localized high-velocity jets that distort wire loops.
- Low Particle, Cleanroom-Grade Surface Dense sintered body with polished finish generates minimal debris. Compatible with Class 100 cleanrooms and will not contaminate pads, bonding wires or chips.
- High Dimensional Repeatability & Drop-In Replacement Strict tolerance control on inner bore, outer diameter and locating features. Direct replacement for OEM spare parts with minimal airflow recalibration.
- Fully Customizable Geometry Custom groove quantity, groove angle, ID/OD, height and mounting interface to match wire bonder model, wire material and bonding speed.
3. Typical Applications
- Wire bonding: Gold wire, copper wire, palladium alloy wire ball bonding
- Compatible equipment: KS Iconn / Connx / Maxum, ASM series wire bonders
- Packaging products: LED chips, COB modules, MEMS sensors, diodes and small ICs
- Core function: Nitrogen protection for EFO free-air ball formation
4. Technical Specification Table
表格
| Item | Technical Parameter |
|---|---|
| Product Name | Ceramic Ring Air Nozzle / Wire Bonding Nitrogen Shroud |
| Material | 99.9% High-Purity Alumina Ceramic |
| Airflow Structure | Annular multi-groove laminar flow design |
| Compatible Machines | KS, ASM and custom wire bonders |
| Inner Diameter | Φ2.0 mm ~ Φ6.0 mm (customizable) |
| Outer Diameter | Φ6.0 mm ~ Φ12.0 mm (customizable) |
| Overall Height | 3.0 mm ~ 8.0 mm (customizable) |
| Dimensional Tolerance | ±0.01 mm |
| Air Groove Tolerance | ±0.005 mm |
| Operating Temperature | -20℃ ~ 800℃ |
| Recommended Gas | High-purity Nitrogen (N₂) |
| Working Gas Pressure | 0.02 ~ 0.08 MPa |
| Surface Roughness | Ra ≤0.2 μm, polished |
| Cleanroom Rating | Class 100 |
| Mounting Method | Press-fit / screw-locked to gas manifold |
| Suitable Wires | Gold wire, copper wire, palladium alloy wire |
5. Operation & Maintenance Notes
- Supply dry, oil-free nitrogen. Moisture or oil residue clogs fine grooves and causes uneven shielding.
- Handle with care. Alumina ceramic is brittle; avoid drops and lateral impact that cause chipping.
- Periodically inspect grooves for wire debris and metal spatter. Use ultrasonic cleaning for blockages.
- Replace promptly if ceramic chipping, groove distortion or rising dark-ball rate is observed.
- Maintain nitrogen pressure within the recommended window: overpressure disturbs wire loops, insufficient pressure leads to oxidation.
