1. Product Overview
The spring-loaded ceramic suction nozzle is a precision vacuum pickup component widely used in semiconductor die bonders and high-precision SMT placement equipment. It is assembled with an alumina ceramic tip, stainless steel body and built-in compression spring. The spring buffer structure provides compliant Z-axis contact force during chip picking and placement, effectively buffering impact pressure to avoid crushing, cracking or indentation on delicate chips such as LED, Mini LED, Micro LED and small IC dies.
With ultra-precise inner vacuum channel and high concentricity machining, it maintains stable vacuum suction under high-speed cyclic operation. The ceramic tip features excellent wear resistance, anti-static performance and low particle generation, making it a core consumable for die bonding packaging processes.
2. Core Features & Advantages
- Spring Buffer Compliant Design Built-in precision spring absorbs collision force when contacting chips. Contact pressure is controllable to reduce chip damage, dark current and IR failure, greatly improving packaging yield.
- High-Purity Alumina Ceramic Tip Made of 99.9% alumina ceramic, high hardness, wear-resistant, low friction, anti-static, non-sticky to phosphor paste and solder flux, less contamination.
- Precision Vacuum Channel & High Concentricity Micro-hole machining with tight tolerance, smooth internal airflow, stable vacuum holding, low leakage, good consistency in mass production.
- Stainless Steel Main Body CNC machined stainless steel shank, high rigidity, corrosion-resistant, stable mounting on die bonder spindles.
- Ultra-Fine Orifice Available Micro tip sizes support tiny chips starting from 3mil, suitable for fine-pitch and micro semiconductor packaging.
- Long Cycle Life & Cleanroom Grade Low wear debris, compatible with cleanroom environment; properly calibrated nozzles support millions of pick-and-place cycles.
- Customization Supported Custom tip diameter, orifice shape, total length, spring force and mounting interface per customer drawings and die bonder models.
3. Typical Applications
- Semiconductor packaging: LED, Mini/Micro LED die bonding
- IC packaging: Small chip, sensor die pickup and placement
- Optoelectronics: Laser diode, photodiode packaging
- Precision SMT: Ultra-thin and fragile component placement
- Compatible equipment: Various automatic die bonders and high-precision placement machines
4. Technical Specification Table
表格
| Item | Technical Parameter |
|---|---|
| Product Name | Spring-Loaded Ceramic Suction Nozzle / Die Bonding Spring Nozzle |
| Tip Material | 99.9% High-Purity Alumina Ceramic |
| Body Material | SUS304 / SUS316 Stainless Steel |
| Internal Spring | High-strength stainless steel spring wire |
| Tip Orifice Size | 3mil, 3.5mil, 4mil, 5mil, 6mil, 8mil, custom micro bore |
| Outer Tip Diameter | Customized according to chip size |
| Total Length | Custom (standard: 10mm / 14mm / 18mm) |
| Spring Force Range | 10g ~ 100g configurable |
| Concentricity Tolerance | ≤0.005 mm |
| Surface Property | Anti-static, low particle, wear-resistant |
| Operating Temperature | -20℃ ~ 450℃ |
| Working Principle | Vacuum negative pressure pick-up, spring buffering contact |
| Compatible Process | Die bonding, chip picking, phosphor coating packaging |
| Mounting Type | Direct replacement for matched die bonder spindles |
5. Operation & Maintenance Notes
- Select suitable spring force. Excessive spring pressure causes chip chipping; insufficient force leads to poor pickup and dropping.
- Handle the ceramic tip carefully. Ceramic is brittle; avoid dropping, side impact and collision.
- Keep the vacuum hole unblocked. Regularly clean phosphor residue and dust to prevent vacuum fluctuation.
- Inspect tip wear, chipping and concentricity periodically. Replace immediately if crack or deformation appears.
- Store in clean, dry and shockproof packaging to avoid contamination before installation.
