Product Overview
Spring test probes, also known as spring-loaded test pins or pogo pins, consist of plunger, barrel and internal compression spring. The spring structure provides stable contact force during compression, achieving reliable temporary electrical connection without damaging pads or components. Widely adopted in ICT, FCT, ATE test fixtures for PCB, IC, semiconductor and electronic module mass testing. Gold plating ensures low contact resistance, excellent conductivity and oxidation resistance.
Key Features
- Spring-loaded compression design: Maintain constant contact force, compensate minor height tolerance of test points
- Gold-plated surface: Low contact resistance, anti-oxidation, stable signal transmission
- Multiple tip styles: Conical, crown, dome, blade, chisel tips for different pads, vias and pins
- Long service life: Up to 1,000,000 compression cycles
- Fine pitch available: Support high-density PCB, BGA, QFN and mini semiconductor package testing
- Customizable: Diameter, stroke, spring force, tip shape and total length on request
Technical Parameters
表格
| Item | Specification |
|---|---|
| Material | Plunger: Beryllium copper / Hardened steel; Barrel: Brass; Spring: Stainless steel / Music wire |
| Surface Treatment | Gold plating over nickel |
| Barrel Diameter | φ0.2mm – φ2.5mm (custom fine pitch) |
| Stroke | 0.5mm – 6.0mm |
| Spring Force | 5gf – 300gf |
| Contact Resistance | 15 ~ 100 mΩ |
| Rated Current | 1A ~ 8A continuous |
| Operating Temperature | -40℃ ~ +120℃ |
| Cycle Life | 50,000 ~ 1,000,000 times |
| Tip Types | Conical, crown, dome, blade, chisel |
| Minimum Pitch | 0.3mm (fine pitch version) |
Application
- PCB Testing: ICT in-circuit test, FCT functional test for printed circuit boards
- Semiconductor & IC: BGA, QFN, wafer and chip package probing
- Electronics Manufacturing: Connector, camera module, battery and touch module testing
- Automated Test Equipment (ATE): Test fixture, jigs for mass production inspection
- New Energy: Battery pack, power module electrical performance testing
Spring Test Probe vs Ordinary Fixed Test Pin
表格
| Item | Spring Test Probe | Fixed Test Pin |
|---|---|---|
| Structure | Built-in spring, compressible | Rigid fixed pin |
| Contact Force | Controlled & stable | Force hard to control, easy to scratch pads |
| Tolerance Compensation | Compensate height difference | No tolerance compensation |
| Damage Risk | Low with proper spring force | High risk of denting or scratching test pads |
| Use Case | Mass automated fixture testing | Manual simple inspection |
| Service Life | High cycle life | Short, easy tip wear |
