1. Product Overview
The tungsten carbide ceramic suction nozzle is a composite precision vacuum pickup consumable for die bonders. It adopts a tungsten carbide main body combined with alumina ceramic tip structure, integrating the high rigidity of tungsten carbide and the low-chip-damage property of ceramic. It uses vacuum negative pressure to pick and place tiny chips such as LED, Mini/Micro LED and small IC dies.
Compared with full-tungsten-carbide nozzles, the ceramic contact tip reduces chip indentation, dark current and IR failure. Meanwhile, the tungsten carbide shank provides superior structural rigidity and impact resistance, less prone to bending during high-speed transfer. It is widely used in semiconductor packaging, COB modules, optoelectronic and sensor die bonding processes, compatible with ASM, Shinkawa, and other mainstream die attach equipment.
2. Core Features & Advantages
- Composite Tungsten Carbide + Ceramic Structure High-strength tungsten carbide shaft for anti-bending and stable positioning; 99.9% alumina ceramic tip for soft contact with chips, minimizing pressure marks and die cracking. Balances rigidity and chip protection.
- Extreme Wear Resistance & Long Service Life Tungsten carbide substrate features ultra-high hardness and bending resistance, not easy to deform under high-speed reciprocation. Ceramic tip resists wear from repeated pickup, outperforming single-material metal nozzles.
- Micro Precision Vacuum Channel & High Concentricity Ultra-precision micro-hole machining and mirror polishing for the inner airflow passage. Stable vacuum holding, low leakage, consistent pickup repeatability for ultra-fine die sizes down to 3mil.
- Low Particle & Anti-Static Performance Dense sintered ceramic tip produces minimal particles, suitable for cleanroom packaging. Reduces contamination to die surfaces and phosphor layers.
- High Dimensional Consistency & Direct Replacement Strict tolerance control on mounting shank, locating surface and tip orifice. Drop-in replacement for original die bonder spare parts.
- Fully Customizable Design Custom tip orifice, outer tip diameter, total length, taper angle and mounting shank size based on machine model and chip dimensions.
3. Typical Applications
- Semiconductor packaging: LED, Mini/Micro LED, sensor, diode and small IC die bonding
- Compatible equipment: ASM, Shinkawa, Hanwha and other automatic die bonders
- Core function: Vacuum pickup, transfer and placement of fragile semiconductor dies
- Process environment: Class 100 cleanroom, mass-production die attach
4. Technical Specification Table
表格
| Item | Technical Parameter |
|---|---|
| Product Name | Tungsten Carbide Ceramic Suction Nozzle / Composite Die Bonding Nozzle |
| Material | Shank: Tungsten Carbide (WC); Tip: 99.9% High-Purity Alumina Ceramic |
| Tip Orifice Size | 3mil, 3.5mil, 4mil, 5mil, 6mil, 8mil, custom micro bore |
| Tip Outer Diameter | Customized according to chip size |
| Total Length | Custom (standard: 10mm / 14mm / 18mm) |
| Concentricity Tolerance | ≤0.005 mm |
| Surface Property | Anti-static, low particle, wear-resistant |
| Hardness of Tungsten Carbide Shank | ≥90 HRA |
| Operating Temperature | -20℃ ~ 450℃ |
| Working Principle | Vacuum negative pressure pick-up |
| Mounting Type | Direct replacement for matched die bonder spindles |
| Applicable Dies | LED, Mini/Micro LED, MEMS sensor, discrete IC chips |
5. Operation & Maintenance Notes
- Handle the ceramic tip carefully. Ceramic is brittle; avoid side impact, dropping and collision to prevent chipping.
- Select the correct orifice size to match the die. Too large an orifice causes unstable suction; too small easily clogs.
- Keep the vacuum channel clean. Regularly remove phosphor powder and chip debris by ultrasonic cleaning.
- Inspect tip chipping, orifice wear and concentricity periodically. Replace immediately when chip dropping rate increases.
- Avoid excessive Z-axis contact pressure to prevent ceramic tip breakage and die damage.
