Driven by the explosive growth of AI computing power, high-speed communication, and miniaturized smart hardware, advanced chip packaging has become the core engine of semiconductor performance iteration and capacity expansion, gradually surpassing chip design and wafer manufacturing as the key bottleneck restricting high-end chip output. This article systematically analyzes the latest mainstream chip packaging technologies in 2025–2026, including CoWoS, 3D SoIC, Hybrid Bonding, FOPLP panel-level packaging, and CoPoS. It elaborates on technical principles, performance advantages, industrial application scenarios, and future development trends, providing professional references for semiconductor manufacturing, hardware R&D, and SMT testing engineers.